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15.0W/mK Thermal Conductive Silicone Heat Sink Thermal Pad With Exceptional Thermal Conductivity Rating For AI Processors And Servers

15.0W/mK Thermal Conductive Silicone Heat Sink Thermal Pad With Exceptional Thermal Conductivity Rating For AI Processors And Servers

Détails sur le produit:
Lieu d'origine: Chine
Nom de marque: Ziitek
Certification: UL and RoHs
Numéro de modèle: TIF800HS
Documents: TIF800HS_Data Sheet.pdf
Conditions de paiement et expédition:
Quantité de commande min: 1000 pièces
Prix: 0.1-10 USD/PCS
Détails d'emballage: Carton 24*13*12 cm
Délai de livraison: 3-8 jours ouvrables
Conditions de paiement: T/T
Capacité d'approvisionnement: 100000 pièces/mois
Contact
Description de produit détaillée
Nom des produits: Coussin thermique en Silicone conducteur thermique 15.0W/mK, avec un indice de conductivité thermiqu conducteur thermique: 15,0 W/mK
Dureté: 45 rivage 00 échantillon: Échantillon gratuit
Mots-clés: Coussin thermique Couleur: Gris
Application: Pour les processeurs et les serveurs IA Épaisseur: 0,030"~0,200"/(0,75~5,0 mm)
Densité: 3,3 g/cm³ Construction: Élastomère de silicone chargé en céramique

15.0W/mK Thermal Conductive Silicone Heat Sink Thermal Pad With Exceptional Thermal Conductivity Rating For AI Processors And Servers

Products description


The TIF®800HS Seriesis a high-end compressible thermal pad designed to meet top-level cooling requirements while maintaining excellnt assembly workmanship. Through an innovative material formulation, it successfully achieves an ideal combination of ultra-high thermal conductivity and moderate hardness. This unique performance balance allows it to efficientlyhandle the cooling challenges posed by ultra-high heat flux densities,while also providing good mechanical strength and compressibility, making it easy to process and install. It offers a reliable interface material solution with both outstanding thermal performance and high reliability for high-power-density electronic devices.


Features 

> Good thermal conductive 15.0W/mK
> Good softness and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
> RoHS compliant
> UL recognized

Applications 

> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply

Key attributes 


Typical Properties of TIF®800HS Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.3 ASTM D792
Thickness Range(inch/mm) 0.030 0.040~0.200 ASTM D374
0.75 1.00~5.00
Hardness (Shroe 00) 45 45 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant@ 1MHz 9.0 ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 15.0 W/m-K ASTM D5470
15.0 W/m-K ISO22007

 

Product Specifications 


Standard Thickness: 0.030" (0.75mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)
 
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information,please contact us.

15.0W/mK Thermal Conductive Silicone Heat Sink Thermal Pad With Exceptional Thermal Conductivity Rating For AI Processors And Servers 0


Packaging Details & Lead time 


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 1

Company profile 


Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.


Factory Size:8000~10,000 square meters

Factory Country/Region:No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).


Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples


After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.


Why Choose us ? 


1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 2

Coordonnées
Dongguan Ziitek Electronical Material and Technology Ltd.

Personne à contacter: Dana Dai

Téléphone: +86 18153789196

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