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AI Processors AI Servers Thermal Pad With Thermal Conductivity Of 16.0W/mK For Electronics Cooling And Heat Dissipation

AI Processors AI Servers Thermal Pad With Thermal Conductivity Of 16.0W/mK For Electronics Cooling And Heat Dissipation

Détails sur le produit:
Lieu d'origine: Chine
Nom de marque: Ziitek
Certification: UL and RoHs
Numéro de modèle: TIF800TS
Documents: TIF800TS_Data Sheet.pdf
Conditions de paiement et expédition:
Quantité de commande min: 1000 pièces
Prix: 0.1-10 USD/PCS
Détails d'emballage: Carton 24*13*12 cm
Délai de livraison: 3-8 jours ouvrables
Conditions de paiement: T/T
Capacité d'approvisionnement: 100000 pièces/mois
Contact
Description de produit détaillée
Nom des produits: Processeurs AI Coussin thermique pour serveurs AI avec une conductivité thermique de 16,0 W/mK pour conducteur thermique: 16,0 W/mK
Dureté: 45 rivage 00 échantillon: Échantillon gratuit
Couleur: Gris Épaisseur: 0,030"~0,200"/(0,75~5,0 mm)
Densité: 3,3 g/cm³ Mots-clés: Coussin thermique pour serveurs AI
Construction: Élastomère de silicone chargé en céramique Application: Processeurs IA Serveurs IA Refroidissement électronique et dissipation thermique

AI Processors AI Servers Thermal Pad With Thermal Conductivity Of 16.0W/mK For Electronics Cooling And Heat Dissipation

Products description


The TIF®800TS Series is a high-end compressible thermal pad that meets top-level cooling requirements while also ensuring excellent assembly workability. Through an innovative material formulation, it successfully achieves an ideal combination of ultra-high thermal conductivity and moderate hardness. This unique performance balance allows it to efficiently handle the cooling challenges posed by extremely high heat fluxes, while also possessing good mechanical _strength and compressibility, making it easy, to manufacture and install. It provides a thermal interface material solution with both outstanding heat dissipation performance and high reliability for high-power-density electronic devices.


Features 

> Good thermal conductive 16.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses

Applications 

> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations

Key attributes 


Typical Properties of TIF®800TS Series
Property Value Test method
Color Gray Visual
Construction Ceramic filled silicone elastomer ******
Density(g/cm³) 3.3 ASTM D792
Thickness Range(inch/mm) 0.030 0.040~0.200 ASTM D374
0.75 (1.00~5.00)
Hardness (Shore 00) 45 45 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 16.0W/m-K ISO22007

 

Product Specifications 


Standard Thickness: 0.030" (0.75 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mm ×406 mm)


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

AI Processors AI Servers Thermal Pad With Thermal Conductivity Of 16.0W/mK For Electronics Cooling And Heat Dissipation 0


Packaging Details & Lead time 


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 1

Company profile 


Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.


Factory Size:8000~10,000 square meters

Factory Country/Region:No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).


Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples


After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.


Ziitek Culture


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete  teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 2

Coordonnées
Dongguan Ziitek Electronical Material and Technology Ltd.

Personne à contacter: Dana Dai

Téléphone: +86 18153789196

Envoyez votre demande directement à nous (0 / 3000)

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