Name: Dark Gray Thermal Gap Filler Silicone Pads With 5.0W/mK High Thermal Conductivity For Effective Heat Transfer In Telecommunication Hardware
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: Les produits de la catégorie 1 doivent être présentés dans la catégorie 1 de la présente annexe.
Price: 4.10 USD
Availability: InStock

Aperçu Produits protection de courant ascendant de silicone

Dark Gray Thermal Gap Filler Silicone Pads With 5.0W/mK High Thermal Conductivity For Effective Heat Transfer In Telecommunication Hardware

Détails sur le produit:

Lieu d'origine:	Chine
Nom de marque:	Ziitek
Certification:	UL and RoHs
Numéro de modèle:	Les produits de la catégorie 1 doivent être présentés dans la catégorie 1 de la présente annexe.
Documents:	TIF100-50-11F_Data Sheet.pdf

Conditions de paiement et expédition:

Quantité de commande min:	1000 pièces
Prix:	0.1-10 USD/PCS
Détails d'emballage:	Carton 241312 cm
Délai de livraison:	3-8 jours ouvrables
Conditions de paiement:	T/T
Capacité d'approvisionnement:	100000 pièces/mois

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Description de produit détaillée

Nom des produits:	Protections en silicone gris foncé pour remplissage d'espace thermique avec une conductivité the	conducteur thermique:	5,0 W/mK
Construction:	Élastomère de silicone chargé en céramique	Dureté:	65/60 Rive 00
échantillon:	Échantillon gratuit	Couleur:	gris foncé
Épaisseur:	0,010 "(0,25 mm) ~ 0,200" (5,0 mm)	Densité:	3,3 g/cm³
Mots-clés:	Coussinets en silicone pour remplissage d'espace thermique	Application:	Pour un transfert de chaleur efficace dans le matériel de télécommunication

Dark Gray Thermal Gap Filler Silicone Pads With 5.0W/mK High Thermal Conductivity For Effective Heat Transfer In Telecommunication Hardware

Company Profile

Dongguan Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 2

Products description

The TIF^®100-50-11F Series is a structurally supportive thermal pad designed to provide high heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat, and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation,insulation, and mechanical stability.

Features

> Good thermal conductive 6.5W/mK
> Broad range of hardnesses available
> Outstanding thermal performance
> Available in varies thicknesses
> Outstanding thermal performance

> Soft and compressible for low stress applications

Applications

> Cooling components to the chassis of frame
> High speed mass storage drives
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video component

Key attributes

Typical Properties of TIF^®100-50-11F Series
Property	Value		Test method
Color	Dark Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.3		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.00)
Hardness	65 Shore 00	60 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant @1MHz	7.5		ASTM D150
Volume Resistivity(Ohm-meter)	＞1.0X10¹²		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity(W/m-K)	5.0		ASTM D5470
	5.0		ISO22007

Product Specifications

Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16” (406 mm X406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Dark Gray Thermal Gap Filler Silicone Pads With 5.0W/mK High Thermal Conductivity For Effective Heat Transfer In Telecommunication Hardware 1

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 1

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

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