La protection conductrice thermique est regardante et travaillante très bon. Nous n'avons aucun besoin de l'autre protection conductrice thermique maintenant !
—— Peter Gay
J'avais coopéré avec Ziitek pendant 2 années, ils ont fourni les matériaux conducteurs thermiques de haute qualité, et la livraison à temps, recommandent leurs matériaux de changement de phase
—— Antonello SAU
Bonne qualité, bon service. Votre équipe toujours nous donner l'aide et la résolution, espèrent que nous serons bon associé tout le temps !
White 1.2W/mK Two Compound Thermally Conductive Potting Compound for Electronic Component TIS™680-12AB Series is a two-part silicone potting adhesive with high thermal conductivity, room temperature curable... Lire la suite
Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation TIE®380-45 is a single-component heat-curable modified epoxy resin adhesive containing high-purity thermally conductive ... Lire la suite
High Thermal Conductivity Two-Component Epoxy Resin Thermal Conductivity Potting Adhesive For Power Supply TIE®280-15AB is a two-component epoxy resin sealantwithgood thermal conductivity and room temperature ... Lire la suite
Two Components 1.0W/MK Thermally Conductive Potting Compound For 5G Base Station & Infrastructure Product Description TIS ®680-10AB is a two-component potting adhesive. When Component A and Component B are ... Lire la suite
3.5W/mK Silicone Thermally Conductive Potting Two Parts Fire Resistant LED Lighting Potting TIS™680-35AB is a two-component, high thermal conductive, low temperature cured, long pot life , fire resistant Silica ... Lire la suite
3.0 W/MK Thermally Conductive Silicone Thermal Pad With12 Shore 00 For Micro Heat Pipe Thermal Solutions Company Profile Dongguan Ziitek Electronic Material and Technology Ltd. (ZIITEK) has been deeply involved ... Lire la suite
CPU Thermal Pad High Thermal Conductive Material For Heat Transfer In Electronic Devices And Telecommunication Equipment Company Profile Ziitek Electronic Material and Technology Ltd(ZIITEK) has been deeply ... Lire la suite
4.5W/MK Thermal Conductive glue Material Conductive Epoxy Resin Potting Compound adhesive Gel Low Thermal Resistance TIE®380-45 is a single-component heat-curable modified epoxy resin adhesive containing high... Lire la suite
Two-Component 2.5W/MK Exoxy Resin Thermal Conductive Glue For Automotive Starters Potting Products description TIE®280-25AB is a two-component epoxy resin sealantwithgood thermal conductivity and room ... Lire la suite