Brief: Discover the new type manufactured insulation silicone thermal pad, TIF220-01U Series, designed for high-speed mass storage drives. This advanced thermal pad offers excellent heat transfer, insulation, and damping properties, perfect for miniaturized and ultra-thin designs. Learn more about its features and applications in this video.
Related Product Features:
Bonne conductivité thermique de 1,25 W/mK pour un transfert de chaleur efficace.
Disponible dans différentes épaisseurs de 0,010" à 0,200" pour différentes applications.
UL recognized and compliant with UL94 V-0, SGS, and ROHS standards.
High tack surface reduces contact resistance for better performance.
Ceramic-filled silicone elastomer construction ensures durability and reliability.
Broad range of hardnesses available to meet specific requirements.
Suitable for applications like LED TVs, CPUs, memory modules, and telecommunication hardware.
Can be customized with pressure-sensitive adhesive on one or both sides.
FAQ:
Quelle est la conductivité thermique du coussin thermique de la série TIF220-01U ?
Le pad thermique TIF220-01U Series a une conductivité thermique de 1,25 W/mK, assurant un transfert de chaleur efficace.
What standards does the TIF220-01U Series comply with?
The TIF220-01U Series is UL recognized and complies with UL94 V-0, SGS, and ROHS standards.
Can the TIF220-01U Series thermal pad be customized with adhesive?
Yes, the TIF220-01U Series can be customized with pressure-sensitive adhesive on one side (A1 suffix) or both sides (A2 suffix) upon request.