Brief: Discover the TIC™800P Series PCM Phase Change Material, designed for communications equipment and wireless stations. This pink thermal interface material softens at 50℃, reducing thermal resistance with no performance degradation after 1,000 hours at 130℃. Ideal for CPUs, display cards, and more.
Related Product Features:
Low melting point thermal interface material that softens at 50℃ to fill microscopic irregularities.
Solides flexibles à température ambiante sans éléments de renforcement pour des performances thermiques optimales.
Aucune dégradation des performances thermiques après 1 000 heures à 130℃ ou 500 cycles de -25℃ à 125℃.
Naturally tacky at room temperature, eliminating the need for adhesives.
Thermal resistance of 0.024℃-in²/W for efficient heat dissipation.
Disponible en épaisseurs standard de 0,005", 0,008" et 0,010".
Suitable for applications like CPUs, display cards, and power supplies.
Comes with white release paper and bottom liner for easy handling.
FAQ:
Quelle est la température de ramollissement de la série TIC™800P ?
La série TICTM800P commence à ramollir à 50°C, ce qui lui permet de remplir les irrégularités microscopiques pour une résistance thermique réduite.
Does the TIC™800P Series require adhesives?
No, the material is naturally tacky at room temperature, so no adhesives are required.
What are the typical applications for the TIC™800P Series?
The TIC™800P Series is ideal for CPUs, display cards, mainboards, notebooks, power supplies, heat pipe thermal solutions, memory modules, and mass storage devices.