Name: Thermal Gap Filler Offering Thermal Conductivity 1.5W/mK For In Electronic Device Heat Management
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF100-15-01F
Price: 4.10 USD
Availability: InStock

Aperçu Produits protection de courant ascendant de silicone

Thermal Gap Filler Offering Thermal Conductivity 1.5W/mK For In Electronic Device Heat Management

Détails sur le produit:

Lieu d'origine:	Chine
Nom de marque:	Ziitek
Certification:	UL and RoHs
Numéro de modèle:	TIF100-15-01F
Documents:	TIF100-15-01F_Data Sheet.pdf

Conditions de paiement et expédition:

Quantité de commande min:	1000 pièces
Prix:	0.1-10 USD/PCS
Détails d'emballage:	Carton 241312 cm
Délai de livraison:	3-8 jours ouvrables
Conditions de paiement:	T/T
Capacité d'approvisionnement:	100000 pièces/mois

Contact

Description de produit détaillée

Nom des produits:	Remplisseur d'espace thermique offrant une conductivité thermique de 1,5 W/mK pour la gestion th	conducteur thermique:	1,5 w / mk
Application:	Pour la gestion de la chaleur des appareils électroniques	Dureté:	65/60 Rive 00
échantillon:	Échantillon gratuit	Couleur:	Noir
Épaisseur:	0,010 "(0,25 mm) ~ 0,200" (5,0 mm)	Densité:	2.3g/cm³
Mots-clés:	Remplissage d'écart thermique	Construction:	Élastomère de silicone chargé en céramique

Thermal Gap Filler Offering Thermal Conductivity 1.5W/mK For In Electronic Device Heat Management

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 2

Products description

The TIF^®100-15-01F Series is a structurally supportive thermal pad designed to provide good heat dissipation while also ensuring structural support and durability. It can reliably fillinterfacegaps,transfer heat,and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation,insulation,
and mechanical stability.

Features

> Good thermal conductive 6.5W/mK

> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
> RoHS compliant
> UL recognize

Applications

> Cooling components to the chassis of frame
> High speed mass storage drives
> CPU
> Display card
> Mainboard/mother board
> Medical Devices
> Auditioning electronic products
> Unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers

Key attributes

Typical Properties of TIF^®100-15-01F Series
Property	Value		Test method
Color	Black		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	2.3		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.00)
Hardness (Shore 00)	65	60	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant @1MHz	4.0		ASTM D150
Volume Resistivity(Ohm-meter)	＞1.0X10¹²		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity(W/m-K)	1.5		ASTM D5470
	1.5		ISO22007

Product Specifications

Standard Thickness: 0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16" (406 mm X406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Thermal Gap Filler Offering Thermal Conductivity 1.5W/mK For In Electronic Device Heat Management 1

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 1

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

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