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Heat Transfer CPU Thermal Pad With 3.2W/MK Thermal Conductive Gap Pad Suitable For Portable Electronics And Industrial Equipment

Heat Transfer CPU Thermal Pad With 3.2W/MK Thermal Conductive Gap Pad Suitable For Portable Electronics And Industrial Equipment

Détails sur le produit:
Lieu d'origine: Chine
Nom de marque: Ziitek
Certification: UL and RoHs
Numéro de modèle: Coussin thermique TIF100-32-05S
Documents: TIF100-32-05S_Data Sheet.pdf
Conditions de paiement et expédition:
Quantité de commande min: 1000 pièces
Prix: 0.1-10 USD/PCS
Détails d'emballage: Carton 24*13*12 cm
Délai de livraison: 3-8 jours ouvrables
Conditions de paiement: T/T
Capacité d'approvisionnement: 100000 pièces/mois
Contact
Description de produit détaillée
Nom des produits: Coussin thermique CPU à transfert de chaleur, avec espace conducteur thermique MK 3.0W, adapté à l&# Numéro de pièce: TIF100-32-05S
Dureté: 65/45 Rive 00 Conductivité thermique: 3.2W/mK
Mots-clés: Pad thermique du processeur Couleur: Bleu
Épaisseur: 0,010 ~ 0,200 pouces (0,25 mm ~ 5,0 mm) échantillon: gratuit
Construction: Élastomère de silicone chargé en céramique

Heat Transfer CPU Thermal Pad With 3.2W/MK Thermal Conductive Gap Pad Suitable For Portable Electronics And Industrial Equipment 



Company Profile


Ziitek Electronic Material and Technology Ltd.  is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


Products description

TIF®100-32-05S  Series is awell-balanced,general-purpose thermal pad.It offers good thermal conductivity_and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.

Features 

> Good thermal conductive: 3.2W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available

Applications 

> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems


Key attributes 


Typical Properties of TIF®100-32-05S Series
Property Value Test method
Color Blue Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00

45 Shore 00

ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 6.0 ASTM D150
Volume Resistivity(Ohm-meter) >1.0X1012  ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity (W/m-K) 3.2 ASTM D5470
3.2 ISO22007


Product Specifications 


Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16" (406 mm X406 mm).


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Heat Transfer CPU Thermal Pad With 3.2W/MK Thermal Conductive Gap Pad Suitable For Portable Electronics And Industrial Equipment 0

Our services 

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

 

FAQ:


Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

 

Q:  Is GAP PAD offered with an adhesive?

A:  Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

 

Q: Are you trading company or manufacturer ? 

A: We are manufacturer in China.

Coordonnées
Dongguan Ziitek Electronical Material and Technology Ltd.

Personne à contacter: Dana Dai

Téléphone: +86 18153789196

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