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Highly Efficient Thermal Conductivity 6.5W/MK Heat Resistant Silicone Pad For Laptop Heatsink, CPU, GPU, SSD, IC, LED Cooler

Highly Efficient Thermal Conductivity 6.5W/MK Heat Resistant Silicone Pad For Laptop Heatsink, CPU, GPU, SSD, IC, LED Cooler

Détails sur le produit:
Lieu d'origine: Chine
Nom de marque: Ziitek
Certification: UL & RoHS
Numéro de modèle: TIF500-65-11US
Conditions de paiement et expédition:
Quantité de commande min: 1000 pièces
Prix: 0.1-10 USD/PCS
Détails d'emballage: Cartons de 24*13*12 cm
Délai de livraison: 3-5 jours ouvrables
Conditions de paiement: T/T
Capacité d'approvisionnement: 1000000 PC / mois
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Description de produit détaillée
Nom des produits: Coussin en Silicone résistant à la chaleur, conductivité thermique très efficace 6.5W/MK, pour dissi Échantillon: Échantillon gratuit
Tension de claquage (V/mm): ≥5500 Plage d'épaisseur: 0,010"~0,200"(0,25mm~5,0mm)
Mots-clés: Pad thermique du processeur Constante diélectrique à 1 MHz: 7,0 MHz
Classement au feu: 94 V0 Couleur: Gris foncé
Conductivité thermique: 6.5W/m-K Application: Dissipateur thermique pour ordinateur portable, CPU, GPU, SSD, IC, refroidisseur LED

Highly Efficient Thermal Conductivity 6.5W/MK Heat Resistant Silicone Pad For Laptop Heatsink, CPU, GPU, SSD, IC, LED Cooler

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

The TIF®500-65-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

 

Features

 

> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses


Applications

 

> Routers
> Medical Devices
> Auditioning electronic products
> Unmanned aerial vehicle(UAV)

> Photovoltaic
> Signal communication
> New energy vehicle

> Motherboard chip
> Radiator
> AI Processors AI Servers

> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

 

Typical Properties of TIF®500-65-11US Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.45 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥ 5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 6.5 ASTM D5470
6.5 ISO22007
Fire rating V-0 UL 94 (E331100)
 
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Highly Efficient Thermal Conductivity 6.5W/MK Heat Resistant Silicone Pad For Laptop Heatsink, CPU, GPU, SSD, IC, LED Cooler 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

 

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Coordonnées
Dongguan Ziitek Electronical Material and Technology Ltd.

Personne à contacter: Dana Dai

Téléphone: +86 18153789196

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