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Varies Thicknesses Ultra-Soft Thermal Gap Pad For AI Processors AI Servers Computer CPU GPU Cooling

Varies Thicknesses Ultra-Soft Thermal Gap Pad For AI Processors AI Servers Computer CPU GPU Cooling

Détails sur le produit:
Lieu d'origine: Chine
Nom de marque: Ziitek
Certification: UL & RoHS
Numéro de modèle: TIF100-40-11US
Conditions de paiement et expédition:
Quantité de commande min: 1000 pièces
Prix: 0.1-10 USD/PCS
Détails d'emballage: Cartons de 24*13*12 cm
Délai de livraison: 3-5 jours ouvrables
Conditions de paiement: T/T
Capacité d'approvisionnement: 1000000 PC / mois
Contact
Description de produit détaillée
Nom des produits: Coussinet thermique Ultra-doux, épaisseurs variables, pour processeurs AI, serveurs AI, refroidissem Épaisseur: 0,010 "(0,25 mm) ~ 0,200" (5,0 mm)
Application: Processeurs IA Serveurs IA CPU d'ordinateur GPU Refroidissement Mots-clés: Plaque d'étanchéité thermique
Gravité spécifique: 3.2 g/cc Tension de claquage: VAC ≥ 5500
Conductivité thermique: 4.0W/m-K Dureté: 65/20 Rive 00
Couleur: Gris foncé

Varies Thicknesses Ultra-Soft Thermal Gap Pad For AI Processors AI Servers Computer CPU GPU Cooling

 

The TIF®100-40-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit.It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

 

Company Profile

 

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

 

Thermal gap pad

 

Thermal graphite sheet/film

 

Thermal double-sided tape

 

Thermal insulation pad

 

Thermal grease

 

Phase change material

 

Thermal gel

 

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL


Features


> Good thermal conductive: 1.5W/mK
> Available in varies thicknesses
> Broad range of hardnesses available
> Outstanding thermal performance
> High tack surface reduces contact resistance


Applications


> LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
> Routers
> Telecommunication hardware

> Mainboard/mother board

> IT infrastructure

> GPS navigation and other portable devices

> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes

 

 

Typical Properties of TIF®100-40-11US Series
Property Value Test method
Color Dark gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.2 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.0)
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 4.0W/m-K ASTM D5470
4.0W/m-K ISO22007

 

Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mm×406 mm)


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is availablein custom shapes and various forms.
For other thicknesses or more information, please contact us.

Varies Thicknesses Ultra-Soft Thermal Gap Pad For AI Processors AI Servers Computer CPU GPU Cooling 0

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

FAQ

 

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

 

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

 

 

 

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

 

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

Coordonnées
Dongguan Ziitek Electronical Material and Technology Ltd.

Personne à contacter: Dana Dai

Téléphone: +86 18153789196

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