Name: Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Cpu Gpu Ram
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF100-10-02F Series
Price: 4.10 USD
Availability: InStock

Aperçu Produits protection de courant ascendant de silicone

Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Cpu Gpu Ram

Détails sur le produit:

Place of Origin:	China
Nom de marque:	Ziitek
Certification:	UL & RoHS
Model Number:	TIF100-10-02F Series

Conditions de paiement et expédition:

Minimum Order Quantity:	1000pcs
Prix:	0.1-10 USD/PCS
Packaging Details:	241312cm cartons
Delivery Time:	3-5 work days
Payment Terms:	T/T
Supply Ability:	1000000 pcs/month

Contact

Description de produit détaillée

Products name:	Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Cpu Gpu Ram	Certification:	RoHS and UL recognized
Thinkness range:	0.020"(0.5mm)~0.200" (5.0mm)	Sample:	Sample Avaliable
Flam rating:	94 V0	Hardness:	60 Shore 00
Thermal Conductivity:	1.0W/mK	Color:	Gray
Keywords:	Silicone Thermal Pads
Mettre en évidence:	silicone thermal pad for CPU GPU , electrical insulation thermal gap filler , 0.5 to 5.0mm thermal pad

Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Cpu Gpu Ram

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Product description

TIF100-10-02F Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Features

> Good thermal conductive : 1.0W/mK
> Soft and Compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thickness

> Easy release construction
> Electrically isolating
> High durability

Applications

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Display card
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

Typical Properties of TIF100-10-02F Series
Color	Gray	Visual
Construction & Compostion	Ceramic filled silicone elastomer	*******
Specific Gravity	2.3g/cc	ASTM D297
Thickness range	0.020"(0.5mm)~0.200" (5.0mm)	ASTM C351
Hardness (thickness ≥1.0mm)	60 Shore 00	ASTM 2240
Dielectric Breakdown Voltage	>5500 VAC	ASTM D412
Operating Temp	-40 ~160℃	*******
Dielectric Constant	4.0 MHz	ASTM D150
Volume Resistivity	1.0X10¹²Ohm-meter	ASTM D257
Fire rating	94 V0	equivalent UL
Thermal conductivity	1.0W/mK	ASTM D5470
Outgassing(TML)	0.35%	ASTM E595

Product Specification

Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)

Product Sizes: 8" x 16"(203mm x406mm)
Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming

Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Cpu Gpu Ram 0

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

Produit Tag:

protection conductrice de la chaleur,

protection de réémetteur isofréquence,

protection de refroidissement thermique

Coordonnées

Dongguan Ziitek Electronical Material and Technology Ltd.

Personne à contacter: Dana Dai

Téléphone: +86 18153789196

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Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Cpu Gpu Ram

Products name: Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Cpu Gpu Ram

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Thinkness range: 0.020"(0.5mm)~0.200" (5.0mm)

Sample: Sample Avaliable

Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Cpu Gpu Ram

Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Cpu Gpu Ram

silicone thermal pad for CPU GPU

electrical insulation thermal gap filler

0.5 to 5.0mm thermal pad

protection conductrice de la chaleur,

protection de réémetteur isofréquence,

protection de refroidissement thermique