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Good Insulation Ultra High Thermal Conductivity Gap Filler Pad For AI Servers

Good Insulation Ultra High Thermal Conductivity Gap Filler Pad For AI Servers

Détails sur le produit:
Lieu d'origine: Chine
Nom de marque: Ziitek
Certification: UL & RoHS
Numéro de modèle: TIF600P
Conditions de paiement et expédition:
Quantité de commande min: 1000 pièces
Prix: 0.1-10 USD/PCS
Détails d'emballage: Cartons de 24*23*12 cm
Délai de livraison: 3-5 jours ouvrables
Conditions de paiement: T/T
Capacité d'approvisionnement: 1000000 PC / mois
Contact
Description de produit détaillée
Nom de produits: Bonne protection ultra élevée de remplisseur d'écart de conductivité thermique d'isolation p Application: Serveurs IA
Plage d'épaisseur: 0,5-5,0 mmT Mots-clés: protection thermique de réémetteur isofréquence
Constante diélectrique @1MHz: 4.5 Couleur: grenat
Tension de claquage (V/mm)): ≥5500 Incendie: UL94 V-0
Conductivité thermique: 6.0W/m-K Construction: Élastomère en silicone rempli en céramique

Good Insulation Ultra High Thermal Conductivity Gap Filler Pad For AI Servers

 

 Company Profile

 

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

The TIF®600P Series is a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness . This balanced design provides both good surface conformity and excellent ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between costand performance.

 

Features:
 

> Good thermal conductivity: 5.0W/mK

> Ultra soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> Available in varies thicknesses
> Broad range of hardnesses available
> Outstanding thermal performance


Applications

 

> AI Servers, Inverters, Telecom Devices

> Power tools
> Network communication products
> Electric vehicle batteries Computer CPU/GPU Cooling
> New energy vehicle power systems

> Display card
> Mainboard/mother board
> Notebook

> Power supply
> Heat pipe thermal solutions

> SMD LED module
> LED Flesible strip, LED bar
> LED Panel Light
> LED floor light

> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power

Typical Properties of TIF®600P Series
Property Value Test method
Color Garnet Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm)

0.020~0.030

(0.50~0.5)

0.040~0.200 (1.0~5.0) ASTM D374
Hardness (Shore OO) 60 45 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ***
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity >4.2X1013 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 6.0 W/m-K ASTM D5470
6.0 W/m-K ISO22007

 

Product Specifications


Standard Thickness: 0.020"(0.5 mm)-0.200" (5.00 mm) with increments of 0.01 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)


Component Codes:


Reinforcement Fabric: FG (Fiberglass).

Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

 

The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Good Insulation Ultra High Thermal Conductivity Gap Filler Pad For AI Servers 0

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

 

Coordonnées
Dongguan Ziitek Electronical Material and Technology Ltd.

Personne à contacter: Dana Dai

Téléphone: +86 18153789196

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